PIC16F1786-I/SP

Product Overview

Category

The PIC16F1786-I/SP belongs to the category of microcontrollers.

Use

This microcontroller is commonly used in various electronic applications that require embedded control and processing capabilities.

Characteristics

• High-performance 8-bit RISC architecture
• Flash program memory with self-read/write capability
• Low power consumption
• Wide operating voltage range
• Enhanced peripheral integration
• Multiple communication interfaces
• Flexible I/O options

Package

The PIC16F1786-I/SP is available in a 28-pin plastic dual inline package (DIP).

Essence

The essence of the PIC16F1786-I/SP lies in its ability to provide efficient and reliable control and processing capabilities for a wide range of electronic devices and systems.

Packaging/Quantity

This microcontroller is typically packaged in tubes or trays, with quantities varying depending on the supplier and customer requirements.

Specifications

• CPU Speed: Up to 32 MHz
• Program Memory Size: 14 KB
• RAM Size: 1.5 KB
• Number of I/O Pins: 25
• Analog-to-Digital Converter (ADC): 10-bit, 13 channels
• Timers: 3 x 8-bit, 1 x 16-bit
• Communication Interfaces: UART, SPI, I2C
• Operating Voltage Range: 2.3V to 5.5V
• Temperature Range: -40°C to +125°C

Detailed Pin Configuration

The PIC16F1786-I/SP has a total of 28 pins, each serving a specific purpose. The pin configuration is as follows:

1. RA0 - Analog Input / Digital I/O
2. RA1 - Analog Input / Digital I/O
3. RA2 - Analog Input / Digital I/O
4. RA3 - Analog Input / Digital I/O
5. RA4 - Analog Input / Digital I/O
6. RA5 - Analog Input / Digital I/O
7. VSS - Ground
8. VDD - Power Supply
9. RA7 - Analog Input / Digital I/O
10. RB0 - Digital I/O
11. RB1 - Digital I/O
12. RB2 - Digital I/O
13. RB3 - Digital I/O
14. RB4 - Digital I/O
15. RB5 - Digital I/O
16. RB6 - Digital I/O
17. RB7 - Digital I/O
18. VSS - Ground
19. VDD - Power Supply
20. RC0 - Digital I/O
21. RC1 - Digital I/O
22. RC2 - Digital I/O
23. RC3 - Digital I/O
24. RC4 - Digital I/O
25. RC5 - Digital I/O
26. RC6 - Digital I/O
27. RC7 - Digital I/O
28. MCLR - Master Clear (Reset)

Functional Features

The PIC16F1786-I/SP offers a range of functional features that enhance its usability and performance:

• High-speed processing capabilities
• Flash program memory for easy reprogramming
• Integrated analog-to-digital converter for sensor interfacing
• Multiple communication interfaces for data exchange
• Timers for precise timing control
• Flexible I/O options for versatile connectivity
• Low power consumption for energy-efficient designs

Advantages and Disadvantages

Advantages

• High-performance 8-bit RISC architecture
• Wide operating voltage range allows for flexibility in power supply selection
• Enhanced peripheral integration reduces the need for external components
• Low power consumption extends battery life in portable applications
• Ample program memory and RAM for complex applications

Disadvantages

• Limited processing power compared to higher-bit microcontrollers
• Smaller number of I/O pins may restrict the number of external devices that can be connected directly

Working Principles

The PIC16F1786-I/SP operates based on the principles of a typical microcontroller. It executes instructions stored in its program memory, interacts with peripherals and sensors through its I/O pins, and communicates with other devices using various communication interfaces. The microcontroller's internal architecture enables it to perform tasks such as data processing, control logic, and interfacing with external components.

Detailed Application Field Plans

The PIC16F1786-I/SP finds application in various fields, including but not limited to:

1. Industrial Automation: Control systems, motor control, and monitoring devices.
2. Consumer Electronics: Home appliances, gaming consoles, and remote controls.
3. Automotive: Engine control units, dashboard displays, and lighting systems.
4. Medical Devices: Patient monitoring systems, infusion pumps, and diagnostic equipment.
5. Internet of Things (IoT): Smart home devices, wearable technology, and environmental sensors.

Detailed