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CY7C1168V18-375BZC

CY7C1168V18-375BZC

Product Overview

Category

The CY7C1168V18-375BZC belongs to the category of high-speed synchronous SRAM (Static Random Access Memory) chips.

Use

This product is primarily used in applications that require fast and reliable data storage and retrieval. It is commonly employed in various electronic devices such as computers, servers, networking equipment, and telecommunications systems.

Characteristics

  • High Speed: The CY7C1168V18-375BZC offers fast access times, allowing for quick data processing.
  • Large Capacity: With a capacity of 16 megabits (2 megabytes), this SRAM chip provides ample storage space for data-intensive applications.
  • Low Power Consumption: It is designed to operate efficiently, minimizing power consumption and extending battery life in portable devices.
  • Reliable Performance: The chip ensures stable and consistent operation, making it suitable for critical applications that demand high reliability.
  • Wide Temperature Range: It can function reliably across a broad temperature range, making it suitable for use in various environments.
  • RoHS Compliant: The product adheres to the Restriction of Hazardous Substances directive, ensuring its environmental friendliness.

Package and Quantity

The CY7C1168V18-375BZC is available in a compact BGA (Ball Grid Array) package. Each package contains one unit of the SRAM chip.

Specifications

  • Organization: 2M x 8 bits
  • Supply Voltage: 3.3V
  • Access Time: 10 ns
  • Operating Temperature Range: -40°C to +85°C
  • Package Type: 165-ball BGA

Pin Configuration

The CY7C1168V18-375BZC features a 165-ball BGA package with the following pin configuration:

CY7C1168V18-375BZC Pin Configuration

Functional Features

  • Asynchronous and Synchronous Operation: The chip supports both asynchronous and synchronous modes of operation, providing flexibility in different applications.
  • Burst Mode: It offers burst read and write operations, enabling efficient data transfer between the SRAM and other components.
  • Automatic Power Down: The chip includes a power-down feature that reduces power consumption when the device is idle, contributing to energy efficiency.
  • Write Protection: It provides write protection functionality to prevent accidental modification or corruption of stored data.

Advantages and Disadvantages

Advantages

  • High-speed access allows for quick data processing.
  • Large capacity provides ample storage space for data-intensive applications.
  • Low power consumption extends battery life in portable devices.
  • Reliable performance ensures stable operation in critical applications.
  • Wide temperature range enables usage in various environments.
  • RoHS compliance demonstrates environmental friendliness.

Disadvantages

  • Limited availability of alternative models may restrict design options.
  • Higher cost compared to lower-capacity SRAM chips.

Working Principles

The CY7C1168V18-375BZC operates based on the principles of static random access memory. It stores data using flip-flops, which retain information as long as power is supplied. The chip utilizes address lines to select specific memory locations and data lines for reading from or writing to those locations. The control signals determine the mode of operation (asynchronous or synchronous) and manage the timing of data transfers.

Application Field Plans

The CY7C1168V18-375BZC finds application in various fields, including: 1. Computer Systems: Used in high-performance desktops, workstations, and servers for fast data storage and retrieval. 2. Networking Equipment: Employed in routers, switches, and network appliances to handle large volumes of data traffic. 3. Telecommunications Systems: Utilized in base stations, switches, and transmission equipment for efficient data handling in telecommunications networks. 4. Industrial Automation: Applied in control systems and data acquisition devices to ensure reliable and high-speed data processing. 5. Medical Devices: Used in medical imaging equipment, patient monitoring systems, and diagnostic instruments for quick and accurate data storage.

Alternative Models

While the CY7C1168V18-375BZC is a highly capable SRAM chip, alternative models with similar specifications are available from other manufacturers. Some notable alternatives include: - MT45W2MW16BFB-708 WT (Micron Technology Inc.) - IS61WV102416BLL-10TLI (Integrated Silicon Solution Inc.) - AS6C62256-55PCN (Alliance Memory Inc.)

These alternative models offer comparable performance and can be considered as substitutes based on specific design requirements.

In conclusion, the CY7C1168V18-375BZC is a high-speed synchronous SRAM chip that provides fast and reliable data storage capabilities. Its characteristics, such as high speed, large capacity, and

Énumérez 10 questions et réponses courantes liées à l'application de CY7C1168V18-375BZC dans les solutions techniques

Sure! Here are 10 common questions and answers related to the application of CY7C1168V18-375BZC in technical solutions:

  1. Question: What is the maximum operating frequency of CY7C1168V18-375BZC?
    - Answer: The maximum operating frequency of CY7C1168V18-375BZC is 375 MHz.

  2. Question: What is the voltage supply range for CY7C1168V18-375BZC?
    - Answer: CY7C1168V18-375BZC operates with a voltage supply range of 1.7V to 1.9V.

  3. Question: How much memory does CY7C1168V18-375BZC have?
    - Answer: CY7C1168V18-375BZC has a memory capacity of 16 Megabits (2 Megabytes).

  4. Question: Can CY7C1168V18-375BZC be used in automotive applications?
    - Answer: Yes, CY7C1168V18-375BZC is suitable for automotive applications as it meets the required standards.

  5. Question: Does CY7C1168V18-375BZC support synchronous burst mode?
    - Answer: Yes, CY7C1168V18-375BZC supports synchronous burst mode for efficient data transfer.

  6. Question: What is the operating temperature range for CY7C1168V18-375BZC?
    - Answer: CY7C1168V18-375BZC can operate within a temperature range of -40°C to +85°C.

  7. Question: Is CY7C1168V18-375BZC compatible with DDR3 memory interfaces?
    - Answer: Yes, CY7C1168V18-375BZC is designed to be compatible with DDR3 memory interfaces.

  8. Question: Can CY7C1168V18-375BZC be used in low-power applications?
    - Answer: Yes, CY7C1168V18-375BZC has low power consumption and can be used in low-power applications.

  9. Question: Does CY7C1168V18-375BZC support on-die termination (ODT)?
    - Answer: Yes, CY7C1168V18-375BZC supports on-die termination for improved signal integrity.

  10. Question: What is the package type of CY7C1168V18-375BZC?
    - Answer: CY7C1168V18-375BZC comes in a 165-ball BGA (Ball Grid Array) package.

Please note that these answers are based on general information about CY7C1168V18-375BZC and may vary depending on specific application requirements.